<p>Hi, I am in a real dilemma here. I've got the sembcorp scholarship from NTU. the scholarship is very generous as it covers everything, from tuition fees to living expenses. but the downside is that there is a six year bond with the sponsoring company, or its subsidiaries or other singapore registered company. idk if it is possible to run away after graduation. for the last two years, they say that the contract is only a formality, which is not for real. but idk if it will be the same by the time i graduate.</p>
<p>on the other hand, i also have an offer from hku for engineering under the 3 year program, with an entrance scholarship of HKD 120K. </p>
<p>any suggestion ? I really can't decide.</p>